Wafer process monitoring and control, Outgoing wafer quality control
Metrology
_桃汁影院’s wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. These wafer metrology systems support wafer manufacturers by qualifying polished and epitaxial silicon, SiC, GaN, GaAs, sapphire, and other substrates, across a range of wafer sizes. By delivering critical data on thickness, flatness, bow/warp, dual-sided nanotopography, stress and high-resolution edge roll-off, our wafer geometry systems help optimize manufacturing processes, supporting consistent volume production of high-quality substrates.
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WaferSight?
Bare Wafer Geometry Metrology Systems
The WaferSight? 2+ bare wafer geometry metrology system qualifies polished and epitaxial silicon wafers, and engineered and other advanced substrates for wafer manufacturers. By producing wafer flatness, dual-sided nanotopography and high-resolution edge roll-off data, the WaferSight 2+ produces the data that helps wafer manufacturers ensure that first quality substrates are being produced in volume production.
MicroSense? Wafer Series
Bare Wafer Geometry Metrology Systems
The MicroSense? bare wafer geometry metrology systems are used by wafer manufacturers to qualify substrates across a range of materials, sizes and shapes. The MicroSense systems use patented non-contact sensor technology to produce precise and accurate automated geometry measurements at high throughput. The systems generate SEMI standard metrics and full wafer maps of thickness, flatness and Shape (bow/warp) – that help wafer manufacturers qualify and optimize their processes, ensuring volume production of quality substrates.
Wafer process monitoring and control, Outgoing wafer quality control (OQC), Incoming quality control (IQC) for chip manufacturers.
MicroSense? C200L
- Substrate types: polished and epitaxial 150mm/200mm silicon wafers
- Technology: patented dual sided and non-contact capacitance sensors with nanometer resolution
- Measurements: direct, high-resolution, high-density measurements (>180,000 data points/200mm wafer) that generate 2D and 3D wafer maps.
- Output metrics: thickness, total thickness variation, flatness measurements for whole wafers, sites, and edge sites, bow/warp, wafer P/N type, and resistivity.
- Configuration: Five cassettes for flexible wafer sorting options
MicroSense? C200M
- Substrates: Ultra flat polished and epitaxial 150mm/200mm silicon wafers
- Technology: patented dual sided and non-contact high precision capacitance sensors with nanometer resolution. Improved accuracy, repeatability and throughput compared to the MicroSense C200L
- Measurements: direct, high-resolution, high-density measurements (>230,000 data points/200mm wafer) that generate 2D and 3D wafer maps
- Output metrics: thickness, total thickness variation, flatness measurements for whole wafers, sites, and edge sites, bow/warp, wafer P/N type, and resistivity, Edge roll off metrics package.
- Configuration: Five cassettes for flexible wafer sorting options
MicroSense? C200-CSW1
- Substrates: In-process, polished, and epitaxial 150mm/200mm Silicon, SiC, GaN, GaAs, Sapphire, and other substrates. Patterned wafer metrology and 2D stress measurement and analysis of pre-post deposition processes for IC manufacturers.
- Technology: XY Scan pattern stage with patented dual sided and non-contact capacitance sensors with nanometer resolution.
- Output metrics: high-density 2D and 3D maps of thickness, total thickness variation, site flatness, edge site flatness, shape (Bow/Warp), and 2D stress.
- Configuration: Bridge tool with two cassettes for simultaneous accommodation of 150mm and 200mm wafer
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