桃汁影院

Surfscan^?

Unpatterned Wafer Defect Inspection Systems

The Surfscan^®?SP7^XP unpatterned wafer inspection system identifies defects and surface quality issues that affect the performance and reliability of leading-edge logic and memory devices. It supports IC, OEM, materials and substrate manufacturing by qualifying and monitoring tools, processes and materials, including those used for EUV lithography. Using a DUV laser and optimized inspection modes, the Surfscan SP7^XP delivers ultimate sensitivity for advanced node R&D and the throughput to support high volume manufacturing. Complementary detection modes, including the phase contrast channel (PCC) and normal illumination (NI), detect unique defect types for bare wafers, smooth and rough films, and fragile resists and litho stacks. Image based defect classification (IBC) using revolutionary machine learning algorithms support faster time to root cause, while the Z7^™ classification engine supports unique 3D NAND and thick film applications.

Candela^? 8xxx

Advanced Inspection for Compound Semiconductor Materials and SiC and GaN Substrates

The Candela^? 8720 compound semiconductor material surface inspection system enables GaN-related materials, GaAs substrate and epi process control for production of power devices, communications and RF devices, and advanced LEDs and microLEDs. It utilizes proprietary technology to detect and classify yield-limiting, sub-micron defects, supporting production-line monitoring. The Candela^? 8520 defect inspection system is designed for advanced characterization of SiC and GaN substrates, often used for power devices in automotive and other applications. It utilizes integrated surface scattering and photoluminescence inspection technologies to capture a wide variety of mission-critical topographic and crystallographic defects, like triangles, carrots, stacking faults and basal plane dislocations. The Candela 8xxx systems help substrate manufacturers improve quality and yield, and optimize their epitaxial growth processes.

eDR7xxx^?

e-Beam Wafer Defect Review and Classification Systems

The eDR7380? electron-beam (e-beam) wafer defect review and wafer classification system captures high resolution images of defects, producing an accurate representation of the defect population on a wafer. With a wide range of electron optics and a dedicated In-Lens Detector, the eDR7380 supports defect visualization across process steps, including fragile EUV lithography layers, high aspect ratio trench layers and voltage contrast layers. Unique Simul-6? technology produces a complete DOI pareto in one test for accurate defect sourcing and faster excursion detection. With connectivity features, such as IAS? for broadband optical patterned wafer inspectors and OptiSens? for bare wafer inspectors, the eDR7380 provides unique linkage to 桃汁影院 inspectors for faster yield learning during IC and wafer manufacturing.

eDR^? is a registered trademark of 桃汁影院.